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Analysis of Diamond Wire Cutting Technology
Publish：2018-04-09 View：299
According to the production process, diamond wire can be divided into electroplated diamond wire cutting and resin diamond wire. Diamond cutting wire is made by coating diamond on steel wire through a certain method. Through a diamond cutting machine, the diamond cutting wire can form relative grinding motion with the object, thereby achieving the purpose of cutting.
Diamond wire is a method of composite electroplating that solidifies high hardness and high wear resistance diamond micro powder onto a steel wire substrate to produce bonded abrasive diamond saw wire. During the cutting process, 90% of the tensile strength comes from steel wire, so steel wire is crucial for diamond wire.
During the cutting process of a free abrasive wire saw, the grinding fluid is directly sprayed onto the steel wire and silicon crystal through a nozzle, and the free abrasive is driven by the steel wire of the wire mesh to cut the silicon crystal. Unlike free abrasives, diamond wire binds diamond to steel wire through differential solidification, and the steel wire moves back and forth to cut silicon crystals.
The traditional mortar utilizes the rapid movement of steel wires to bring abrasive containing liquid into the cutting seam of the workpiece, generating cutting action. During the cutting process, silicon carbide is washed away, and only continuous rolling grinding can reduce cutting efficiency. The hardness of silicon carbide is 9.5 (Mohs), while the hardness of diamond is 10 (Mohs). The cutting speed of diamond wire is basically 15m/s, and the normal cutting speed of mortar is basically 9-11.5m/s. If the diamond wire breaks through again, it should be harder, with better self sharpening (polycrystalline diamond), more stable solidification method, and faster wire speed.
Diamond cutting lines have three major advantages compared to traditional processes:
1) Diamond wire cutting has less leakage, long service life, fast cutting speed, high cutting efficiency, and improves production capacity;
2) Quality controlled, low cost per piece, diamond wire cutting causes less damage than mortar wire cutting, which is beneficial for cutting thinner silicon wafers;
3) Environmentally friendly, diamond wire uses water-based grinding fluid (mainly water), which is beneficial for improving the working environment and simplifying post-processing procedures such as cleaning.
Diamond wire is a method of composite electroplating that solidifies high hardness and high wear resistance diamond micro powder onto a steel wire substrate to produce bonded abrasive diamond saw wire. During the cutting process, 90% of the tensile strength comes from steel wire, so steel wire is crucial for diamond wire.
During the cutting process of a free abrasive wire saw, the grinding fluid is directly sprayed onto the steel wire and silicon crystal through a nozzle, and the free abrasive is driven by the steel wire of the wire mesh to cut the silicon crystal. Unlike free abrasives, diamond wire binds diamond to steel wire through differential solidification, and the steel wire moves back and forth to cut silicon crystals.
The traditional mortar utilizes the rapid movement of steel wires to bring abrasive containing liquid into the cutting seam of the workpiece, generating cutting action. During the cutting process, silicon carbide is washed away, and only continuous rolling grinding can reduce cutting efficiency. The hardness of silicon carbide is 9.5 (Mohs), while the hardness of diamond is 10 (Mohs). The cutting speed of diamond wire is basically 15m/s, and the normal cutting speed of mortar is basically 9-11.5m/s. If the diamond wire breaks through again, it should be harder, with better self sharpening (polycrystalline diamond), more stable solidification method, and faster wire speed.
Diamond cutting lines have three major advantages compared to traditional processes:
1) Diamond wire cutting has less leakage, long service life, fast cutting speed, high cutting efficiency, and improves production capacity;
2) Quality controlled, low cost per piece, diamond wire cutting causes less damage than mortar wire cutting, which is beneficial for cutting thinner silicon wafers;
3) Environmentally friendly, diamond wire uses water-based grinding fluid (mainly water), which is beneficial for improving the working environment and simplifying post-processing procedures such as cleaning.
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Analysis of Diamond Wire Cutting Technology
2018-04-09
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