Origin of Research and Development_Xiamen Pinhe Precision Technology Co., Ltd

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The technology of stone wire saw originated from the multi wire cutting machine for silicon wafers in the photovoltaic industry. The diamond wire adopts the process of electroplating a layer of diamond on a thin metal wire, and uses the diamond on the diamond wire to grind the cut material to complete the material cutting. Since its application in the photovoltaic silicon wafer processing industry in 2015, Diamond Wire has replaced the traditional mortar wire cutting process from 2015 to 2017, with a total inventory of over 10000 units.

From 2017 to 2020, the process replacement of rare earth magnetic materials industry was completed, and the inventory exceeded 10000 units. At the same time, process substitution has been achieved in multiple hard and brittle materials such as sapphire, optical glass, graphite, etc. These devices require lower precision and lower rotational speed. With the development of Chinas photovoltaic industry, the photovoltaic and magnetic materials industries in China occupy more than 95% of the global market, so stone wire saws can only be born on Chinese soil. With the increasing maturity of diamond wire cutting technology, along with multi wire cutting machines, diamond wire, and supporting industrial chains, the cost continues to decrease, and the cutting technology of diamond wire is also constantly developing.

Starting from 2018, Pinhe began researching the application of diamond wire in the stone industry. Due to the small processing size and single material of traditional multi wire cutting machines, cutting ultra large sized stone with diamond wire faces 10 times the size of other industries, and the material is uneven with different sizes. At the same time, the cutting efficiency, cutting cost, machine cost, stability, and other requirements of diamond wire are completely different from those of multi wire cutting machines. Therefore, although the principle of stone wire saw is derived from photovoltaic silicon wafer wire saw, the size, requirements, and other aspects of the equipment are completely different from other multi wire cutting machines, which requires more customer service difficulties. Pinhe has undergone 6 years of arduous research and development since 2018, and has now iterated and upgraded to the sixth generation wire saw, launching 3 mass-produced models that can meet the special needs of different customers.

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